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To: FJB who wrote (24936)6/2/2000 4:53:00 PM
From: BillyG  Read Replies (1) | Respond to of 25960
 
U.S. Commerce objects to Infineon participating in EUV litho consortium
semibiznews.com

By Jack Robertson
Semiconductor Business News
(06/02/00, 11:26:49 AM EDT)

WASHINGTON -- The U.S. Department of Commerce is challenging the
admission of Infineon Technologies AG into the EUV LLC consortium, charging it
gives the German chip maker early access to next generation lithography data
developed at U.S. National Laboratories.

SBN obtained from independent sources a letter from William Reinsch,
undersecretary of Commerce for export administration, asking the Department of
Energy to temporarily withdraw its approval of Infineon to join the EUV group.
Reinsch said DOE rushed ahead to let the German firm into EUV LLC before an
interagency government task force had completed its review. Commerce was
opposing the Infineon EUV participation.

Early last month, Munich-based Infineon announced had joined the Extreme
Ultraviolet LLC consortium (see May 8 story). Infineon, the former chip division of
Siemens AG, is also participating in Europe's Medea project, which is developing
ion-projection lithography (IPL) as a potential technology to shrink chip
geometries below 70 nanometers (0.07 micron).

Spokespersons for both the Commerce Department and DOE confirmed that
Commerce had written to DOE on the Infineon issue, but both declined to discuss
its contents. A source said as of today, DOE hadn't yet responded to Reinsch.

The Commerce Department official was critical of admitting foreign chip makers
as full EUV LLC partners, gaining complete access to the technology. "[DOE]
Secretary Pena had publicly declared several years ago that the EUV LLC
Cooperative R&D Agreement (CRADA) was only for American chip makers," the
letter said. "Members of Congress were also given the same message that EUV
LCC's membership was to be restricted to U.S. companies.

"I recall the origins of the EUV program. The aim was to position U.S. companies
to lead and hopefully dominate international markets with next-generation
semiconductor manufacturing equipment and semiconductor chips. IT is an
American program with global implications, not a global program that was started
with international sponsors," said Reinsch's letter.

"If the rules of the game are to be changed to admit foreign companies as
partners, then at a minimum those new partners should make investments that
are at least commensurate with the value of the technology that has been created
to date."

Reinsch charged that Infineon is making a minimal $10 million investment in EUV
LLC and will receive full technology data for this nominal sum. Moreover, he
claimed Intel Corp., the leading sponsor of EUV LCC, is seeking to admit other
foreign chip makers into the consortium.

"Infineon receives access to intellectual property on EUV technology at a fraction
of the estimated $300 million that has been invested in the development of the
technology by American companies, the U.S. government and the U.S.
taxpayers," said Reinsch's letter.

The latest flap on foreign membership in EUV LCC comes a year after a similar
dispute surrounded the participation of ASM Lithography in the program. However,
Reinsch said ASML, based in the Netherlands, was approved only after the firm
agreed to share its EUV research being developed as part of a European Union
program, and to build major facilities in the U.S.

"Infineon should be prohibited from placing its researchers at DOE's national
nuclear weapons and multi-purpose laboratories [working on EUV development],"
the letter said. Reinsch alluded to the security problems at DOE National Labs
with transfer of sensitive data to foreign sources.

The Department Commerce official also asserted, "In addition, Infineon should be
required to buy a fixed number of EUV production machines from factories sited in
the U.S."



To: FJB who wrote (24936)6/8/2000 6:08:00 PM
From: orkrious  Read Replies (1) | Respond to of 25960
 
Cymer Ships First F2 Laser to Ultratech Stepper for Use In Next-Generation Lithography Process Development

biz.yahoo.com