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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (4502)	8/11/2000 2:07:06 PM
From: kash johal	Read Replies (1) \| Respond to of 275872

Jozef, re: pin limited. IC's almost exclusively have been manufactured by putting I/O and bonding pads on the chip pheriphery. These die are then "bonded" using a wire bonder that connects by Al wire the bonds on chip to gold fingers on the package. So with increasing pin count the die size becomes determined by number of I/O even if logic stays steady. Using flipchip assembly type technology you can place I/O bond pads all over the die. Intel and AMD??? i guess are now doing this and therefore penalty for huge I/O counts is reduced. regards, Kash