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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Mani1 who wrote (5444)	8/17/2000 4:59:49 PM
From: Joe NYC	Read Replies (2) \| Respond to of 275872

Mani, The actual bulk thermal conductivity of the fins does not need to be anything over 50 W/mK. Aluminum is around 185 and Copper is at 400. Making the fins out of Copper gives virtually no advantage and the added weight puts stress on the package. I think the added weight not relevant compared to pressure needed by the clip attaching the heatsink to the CPU. (To satisfy AMD's spec for the termal solution) If you read some hardware newsgroups, it actually is a problem. There are very few Socket A heatsinks out there that satisfy AMD's requirements. There are some reports of people cracking their core while attaching the heatsink to the CPU. Basically, similar reports that we have heard about Intel's FC CPUs. I think AMD should hurry up and sell the Boxed versions of the CPU with the heatsink already attached to avoid these problems people will encounter in the DYO market. Joe

To: Mani1 who wrote (5444)	8/17/2000 11:49:38 PM
From: Ali Chen	Read Replies (1) \| Respond to of 275872

Again, <Coppermine consumes much less power than Athlon.> If 30% less is "much less", then much less:). <I have not seen any "all copper" heat sink. That is got to be the dumbest thing I have ever heard.> <Making the fins out of Copper gives virtually no advantage... There is virtually no thermal gradient in the fins..> I don't want to enter into another useless discussion. I guess you just need to buy a cheap $25,000 infrared camera to see how reality fares relative to your statements. I could not find that link to newly intorduced copper heatsinks for P-III from some recent Expo, but just to slightly support my statements: Copper heat sinks micforg.co.jp rtcgroup.com - copper fins are 20% more efficient coolwhip.dk Regards, - Ali