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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (5454)	8/17/2000 5:09:30 PM
From: Mani1	Read Replies (1) \| Respond to of 275872

Jozef re <<I think the added weight not relevant compared to pressure needed by the clip attaching the heatsink to the CPU. >> The pressure from the spring is very different than a pound of metal being attached to the board. Every time a computer is turned around there is jerk to the package. Re <<If you read some hardware newsgroups, it actually is a problem>> What is? Re <<There are very few Socket A heat sinks out there that satisfy AMD's requirements. >> Yes, that is because of two reasons. One is the geometry of the sink required with the appropriate clip. And another one is that since AMD dissipates more power (the base of the original argument with Ali), there needs to be more fins. Making the fins out of Copper makes no advantage at all. All and all, TBirds are very easy to cool. Mani

To: Joe NYC who wrote (5454)	8/17/2000 6:29:57 PM
From: Goutam	Read Replies (3) \| Respond to of 275872

Joe, >f you read some hardware newsgroups, it actually is a problem. There are very few Socket A heatsinks out there that satisfy AMD's requirements. There are some reports of people cracking their core while attaching the heatsink to the CPU. Basically, similar reports that we have heard about Intel's FC CPUs.> How can they crack the core? The ceramic packages usually contain the silicon chip in a cavity located in the center of the package. I also read a couple of messages on the other boards about people cracking the core while trying to attach the heatsink. I believe they assumed they cracked the core when all it was just chipping of the ceramic package at the corners. Any body that cracked the package while putting the heatsink on it, and blame AMD shouldn't have done it by themselves to start with. The reports I heard about Intel's FC CPU's were different - they developed surface cracks when they got hot (aren't these plastic packages - plastic packages don't chip as the ceramic packages, but the plastic one's can develop surface cracks if the die inside gets too hot.) <I think AMD should hurry up and sell the Boxed versions of the CPU with the heatsink already attached to avoid these problems people will encounter in the DYO market.> I agree. Any thing that makes the CPUs idiot proof in the DIY market would be good for the company. Regards, Goutama