Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Mani1 who wrote (5588)	8/18/2000 7:42:10 PM
From: Bilow	Read Replies (1) \| Respond to of 275872

Hi Mani Ahmadi; Re your technical discussion with Ali Chen on the subject of heat sink design... Sometimes when one realizes that one has hung on too long to the wrong end of a technical discussion, it is best to admit the error with a gentlemanly and mature response like: "You know, there are some things you've explained to me that I hadn't realized. I am going to have to face up to the facts and admit that you were right all along. Thanks for correcting me." I suggest you post something to that effect. Ali has been quite convincing. As to the subject of Tj being not important to heat sink design, you are quite incorrect. What Ali was referring to was the difference between Tj and Tamb, and that difference, along with the power dissipation required, defines the thermal resistance. It is the low thermal resistance that defines the extreme case, and it is quite dependent on Tj. -- Carl P.S. Thanks for keeping this thread relatively pleasant.