To: Kirk © who wrote (36890 ) 8/18/2000 7:10:05 PM From: Proud_Infidel Respond to of 70976 Sematech launches metrology initiative with tool suppliers Effort represents new R&D model for consortium, teaming with equipment firms Semiconductor Business News (08/18/00, 03:06:59 PM EDT) AUSTIN, Tex. -- International Sematech today announced a metrology and yield management tool initiative that teams the semiconductor industry consortium with equipment suppliers to tackle advanced measurement technology for chip feature sizes below 100 nanometers (0.10 micron). Sematech's Metrology/Yield Management Tool Initiative is also a new model for the consortium, which until now has officially partnered with its chip-making members in development programs while involving tool vendors as supporting participants. The new metrology initiative increases the role of tool suppliers to help define next-generation technologies. "By partnering with tool suppliers, we will accelerate advanced measurement technology down to the 100-nm node and promote development of new methods for sub-100 nm," said Rinn Cleavelin, chief operating officer of Sematech. The Austin-based consortium said its new initiative will deal with a range of metrology technologies for critical dimension (CD), control of chemical mechanical planarization (CMP), defect detection, shallow junction depth and uniformity, gate dielectric and low-k film thickness, and pattern overlay in lithography. "As new lithography technology enables the reduction of feature sizes and new materials such as low k and high k dielectrics are introduced, new methods of characterizing masks, measuring process variation and ensuring product quality must be found," Alain Diebold, senior fellow and manager of metrology coordination for the initiative. Diebold and Ronald Remke, manager of yield management, will jointly manage the metrology initiative. The Metrology/Yield Management Tool Initiative will involves several Sematech technical divisions, including the consortium's Advanced Technology Development Facility (ATDF), Front End Processes, Interconnect, and Lithography operations. Sematech said a half dozen tool providers have joined the initiative. These participants and committed tool for the initiative are: Boxer Cross Inc. of Menlo Park. Calif., with its non-contact BX-10 source/drain and ultra shallow junction measurement system; Hitachi Ltd. of Japan with a S9300 CD SEM and a SR-7300 defect tool; KLA-Tencor Corp. of San Jose with a Quantox system for non-contact electrical testing of gate dielectrics, especially high-k materials; Philips Electronics N.V. of the Netherlands with an Impulse 300 tool for measuring metal film thickness; Therma-Wave Inc. of Fremont, Calif., with an Opti-Probe 5240D system for measurement of gate dielectric, low-k and high-k film thickness and refractive index; Veeco Instruments Inc. of Plainview, N.Y., with its Dimension Vx Atomic Force Profiler for measuring the atomic surface texture of integrated circuit wafers. Sematech said it is working with other suppliers to acquire metrology and yield management tools for characterizing photomasks and measuring all the critical aspects of wafer processing. In the program, tool suppliers are able to test their equipment on new high-k and porous low-k materials and new processes such as damascene. Sematech has also created a metrology council to act as a forum for consensus development of in-line measurement systems for wafer fabs.