Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: THE WATSONYOUTH who wrote (108587)	8/27/2000 3:35:05 PM
From: semiconeng	Read Replies (1) \| Respond to of 186894

By your comments, it is clear you still don't have even a fundamental understanding of the actual described process flow and thus could never have actually run this process. I never said that "I ran IBM's process flow." I said that I know what it takes to maintain a tight process window on Reactive ION Etching. Go back and read it again yourself. "If they are employing Dry Etch Techniques, to etch back the interconnect layer, then they are going to have lots of problems controlling the Etch Rates to insure that they don't break trough the Poly Layer. I know all about the amount of intensive labor that it takes to maintain THE TYPE OF DRY ETCH RATES that this type of process demands for logic circuits, SemiconEng