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To: John Walliker who wrote (112341)10/4/2000 10:40:14 AM
From: Ali Chen  Read Replies (1) | Respond to of 186894
 
<It depends on .. the thermal resistance of the particular package type, the thermal resistance of the contact between the processor package and heat sink, the thermal resistance of the heat sink (which depends on the airflow) and it depends on the temperature of the air flowing over the heat sink.>

John, thanks for lecturing on applied college physics.
Last time I checked, the room temperature remained
the same as in the era of pre-1GHz/60C Pentium chips,
as well as major packaging features, altogether
with thermal properties of mass-produced heat sinks.
BTW, the latter remained the same for the last
several billion years as well :)

P.S. Please do not act like a jerk, you should
know exactly what 60C junction temperature mean
for a semiconductor device that dissipates 50W.
There is no point do dispute obvious, only
PhDs like Paul Engel can do this.



To: John Walliker who wrote (112341)10/4/2000 2:44:45 PM
From: Joe NYC  Respond to of 186894
 
John,

I agree with the the list of the variable that go into the equation, but I don't know how it is related to what I said, that it is tougher to guarantee that a CPU doesn't exceed 60C, that it is to guarantee that the CPU doesn't exceed 90C.

Let's look at sports analogy. Suppose you are running hurdles. If you make the hurdle higher, it is more likely that the runner will trip on it or knock if than if the hurdle is low.

Intel places the hurdles for system designers a lot higher with 933 MHz, 1 GHz and 1.13 GHz chips that with slower Intel chips (running within more normal specs), or Athlon chips.

With the hurdle being high, the probability that one of these systems will "trip" is higher.

Joe