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To: Alighieri who wrote (18128)	11/7/2000 10:38:41 PM
From: fyodor_	Read Replies (1) \| Respond to of 275872

<Al: I don't believe that Intel is screening AMD from access to these nor from the latest advancements in litho equipment. Info on both techniques.> Thanks for the link. It provides a nice overview. Just for the record, I wasn't trying to imply any sort of "foul play" by Intel. I was simply saying that a shortage of equipment could hurt AMD. I don't agree with you about the current usage of PSM and OPC, though. See e.g. the following dated September 4 this year (also mentions DuPont Photomasks Inc): electronicnews.com I realize that PSM is certainly applied to some extent, but take the following from the above source: DPI and its customers believe altering aperture phase-shift masks will extend 248-nanometer lithography to the 0.13-micron node before 193nm lithography becomes widespread at the 0.13- and 0.10-micron levels with OPC and embedded phase-shift masks. Edit: So what I may have been referring to is embedded psm, although I'm not really sure what technical differences these terms cover. -fyo

To: Alighieri who wrote (18128)	11/7/2000 10:59:18 PM
From: fyodor_	Read Replies (1) \| Respond to of 275872

Nov. 7 Press Release from ASML - AMD's supplier of litho tools: asml.com ASML Announces Industry's Most Advanced 193nm Lithography System For the 100nm Technology Node New PAS 5500/1100TM System Combines 90 WPH Productivity With the Imaging Performance of a 0.75 Numerical Aperture Lens VELDHOVEN, The Netherlands, November 7, 2000 -- ASML today introduced its newest 193nm Step & Scan lithography tool for high-volume production of semiconductor devices at the 100nm technology node. The PAS 5500/1100TM system provides the highest value of ownership for leading-edge IC makers by combining a 0.75 numerical aperture (NA) lens, improved leveling performance and industry-leading overlay with an exposure capacity exceeding 90 200mm wafers per hour at a dose of 20 mJ/cm2. ASML entered the 193nm lithography equipment market two years ago when it introduced its PAS 5500/900TM tool, the semiconductor industry's first wide-field, 193nm Step & Scan system. Leveraging the process experience gained from its predecessor, the PAS 5500/1100 makes the next productivity leap in 193nm volume manufacturing. The PAS 5500/1100 Step & Scan tool utilizes Carl Zeiss’ new StarlithTM 1100 lens, whose 0.75 NA equals the industry's largest. High-quality optical materials and coatings result in high transmission of 193nm-wavelength light. The illumination source is a 2 kHz, 10 W laser with a bandwidth of 0.35 pm. The PAS 5500/1100 is ASML’s first lithography system to feature reticle alignment at actinic (blue) wavelength, using the 193nm exposure light. The PAS 5500/1100 also includes ASML’s patented ATHENATM wafer alignment system, enabling the tool to deliver industry-leading overlay accuracy. In addition, the wafer-leveling system has been substantially enhanced over previous PAS 5500 models to ensure depth-of-focus process latitude. "Our new PAS 5500/1100 product supports the imaging requirements of the world’s leading-edge IC makers as they migrate to 100nm volume production," said Martin van den Brink, executive vice president of marketing and technology at ASML. "This newest addition to our product portfolio is one of the most advanced 193nm lithography tools available today, providing tighter resolution, better process overlay and higher throughput than any other system currently available on the global market." Initial shipments of the PAS 5500/1100 will begin in March 2001. About ASML: ASM Lithography, founded in 1984, is a world leader in advanced lithography systems that are essential to the fabrication of integrated circuits. ASML is publicly traded on both the Amsterdam Exchange and on the Nasdaq Stock Market® under the symbol "ASML". Visit the company's web site at asml.com for more information.