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To: Mani1 who wrote (21380)12/3/2000 1:57:18 AM
From: PetzRead Replies (1) | Respond to of 275872
 
Mani, with regard to "hot spots" on the die, the Intel P3 actually has a spec on the maximum thermal differential between the on-die thermal diode and the hottest spot on the die.

For the P3 1 GHz, this max differential is 3.8 degC.

Petz



To: Mani1 who wrote (21380)12/3/2000 11:14:00 PM
From: Bill JacksonRead Replies (1) | Respond to of 275872
 
Mani, I think there is more resistance to heat flow in the Si substrate than the 5% you mention. Remember the Al heat sink spreads out in all directions and the newer compounds are better thermal tranmitters across the gap and the new specs calls for the heat sink to be extremely flat and rigid and do not some people use a copper spreader in contact with the die?

Bill


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