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To: Bill Jackson who wrote (21420)	12/4/2000 1:09:44 AM
From: Mani1	Read Replies (2) \| Respond to of 275872

Bill re <<Mani, I think there is more resistance to heat flow in the Si substrate than the 5% you mention.>> I am sure the 30% is sheer exaggeration. I base this opinion on analysis of numerous thermal models over the past several years. Re <<Remember the Al heat sink spreads out in all directions and the newer compounds are better thermal transmitters across the gap and the new specs calls for the heat sink to be extremely flat and rigid and do not some people use a copper spreader in contact with the die?>> I am very up to date as to the latest thermal management material and methods used. I don't know what your point is though. Mani