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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Mani1 who wrote (127813)	2/19/2001 2:04:16 AM
From: Joe NYC	Read Replies (1) \| Respond to of 186894

Mani, The resistance of the thermal lid itself is less than 1 degree, the main temperature rise happens in the interface which is filled with sliver paste. That conductivity can be as much 90,000 W/m^2.k, so with die power density of...errr... 50 W/cm^2, then total temp rise is 6 degrees. I am not sure if I understood what you just told me. Let's take an example - P4. This document: ftp://download.intel.com/design/Pentium4/guides/24920301.pdf shows how they measure the processor case temperature (which for P4 1.5 GHz should not exceed 72 deg C). Page 21 (actually, the whole document is an interesting read) What I am trying to determine is what die temperature the 72 deg C implies (since Intel no longer specifies it for P4. If we determine maximum die temperature the 72 deg die temperature implies, we can find out how it compares to P3 (which ran into some problems in this area) and Athlon. Anyway, does the "total temp rise is 6 degrees" mean that the difference in temperature of 217 mm^2 die and the heat spreader (Tcase) can by up to 6 degrees? If so, does it imply maximum die temperature of up to 78 deg C? (I don't know how localized hot spots on the die enter into this picture). Joe