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To: semiconeng who wrote (131505)	4/2/2001 7:03:32 PM
From: Scumbria	Read Replies (1) \| Respond to of 186894

Semi, You once made a great technical post about M0, disappeared for a few months, and then came back as a complete FUDster. Did you go off to Intel reprogramming during your absence? Scumbria

To: semiconeng who wrote (131505)	4/2/2001 7:06:07 PM
From: Tony Viola	Read Replies (1) \| Respond to of 186894

But, using the PR techniques which have stood it in fine stead for years, it turned the story around by saying it was a breakthrough, when actually it is a delay. The breakthrough, or delay if you look at the release in this different manner, happened or will happen at its Hillsboro, Oregon facility. >>Amusing..... Not True, But Amusing Non The Less. I sent him a note. You mean that Intel does plan to produce 0.13 on 200 mm wafers for a time, before moving to 0.13 on 300 mm, right? Thanks, Tony

To: semiconeng who wrote (131505)	4/2/2001 9:35:00 PM
From: Elmer	Read Replies (2) \| Respond to of 186894

Semi - here's Intel's original press release stating Fab22 would come up on 200mm wafers in 2001 then progress to 300mm. intel.com SANTA CLARA, Calif., Jan. 25, 2000 -- Intel Corporation today announced it will build its first high-volume production manufacturing facility for 300 millimeter wafers, in Chandler, Ariz. The company said it will invest $2.0 billion to build and equip the wafer fabrication facility. The project is contingent upon local governmental approval, expected in the next few weeks. "This facility will help us maintain our leadership in the extremely competitive world of semiconductors. Fab 22 will give us more manufacturing capacity in order to help us better address our customers' growing need for high performance microprocessors," said Mike Splinter, Intel senior vice president and general manager of the Technology and Manufacturing Group. The 300 mm (12-inch) wafer offers 225 percent of the silicon surface area (over twice as much surface area), and about 240 percent of the printed die (individual computer chips) per wafer, relative to standard 200 mm (8-inch) wafers used in many semiconductor manufacturing plants today. In addition, the larger wafers will reduce manufacturing costs per wafer by more than 30 percent. Splinter continued, "Intel plans to bring this fab on line in record time to meet our customers' needs. It will initially begin production using Intel's 0.13-micron process technology with copper metallization on 200 mm wafers in 2001 and transition into the production of 300 mm wafers." A micron is approximately 1/100th the width of a typical human hair.