To: Road Walker who wrote (135252 ) 5/17/2001 4:25:04 AM From: Paul Engel Read Replies (3) | Respond to of 186894 John - More progress (or losses ?) from Intel's Communication divisions: "The new product family will initially include Intel Pentium® III processor-based systems in high-density form factors, with carrier-grade servers based on the Intel Xeon(TM) and Itanium(TM) processor families further in the future. " Paul {=========================}biz.yahoo.com Thursday May 17, 3:15 am Eastern Time Press ReleaseIntel Plans Carrier-Grade Server Products for Telecommunications Industry AMSTERDAM, The Netherlands--(BUSINESS WIRE)--May 17, 2001--In his keynote at the Intel Developer Forum today, Intel Corporation Vice President Mike Fister said the company plans to introduce a family of carrier-grade, Intel-based server products for the telecommunications industry by the end of this year. The Intel® Architecture, carrier-grade server products will deliver world-class performance, reliability and scalability at lower costs from a choice of manufacturers versus today's proprietary telecommunication offerings. The new product family will initially include Intel Pentium® III processor-based systems in high-density form factors, with carrier-grade servers based on the Intel Xeon(TM) and Itanium(TM) processor families further in the future. Carrier-grade servers comply with telecommunications industry requirements for platform ruggedness to survive environmental hazards such as excessive heat and cold, fires and earthquakes. ``Today's announcement marks the next step for Intel-based servers as we introduce value and top performance to a very specific segment in the server market,'' said Mike Fister, vice president and general manager of Intel's Enterprise Platforms Group. ``Intel-based servers will offer telecommunication customers choice, scalability, reliability and top performance -- all at affordable prices -- when compared to RISC-based vendors.'' Intel will sell its new server product lines to Original Equipment Manufacturers (OEMs) and Telecommunication Equipment Manufacturers (TEMs). Intel's telecommunications products will be carrier-grade quality and thus compliant with stringent telecommunication standards including Network Equipment Building Speciation (NEBS) in the United States and European Telecom Standards Institute (ETSI) in Europe. Intel expects to introduce processors, chipsets and boards for inclusion in two types carrier-grade servers based on the Pentium III processor. The first will be in a 1U-sized dual processor server line (1U is a unit of measurement of 1.75 inches). The second will be produced in a 2U form factor. These Intel-based systems will power core telecom, wireless and communication network infrastructures for use in converged high-speed, high-traffic networks used by telecommunication companies, telecom service providers and large corporations. The platforms will run a wide range of wireline and wireless applications, including software-enabled switches (soft switches), adjunct services, location-based wireless services and wireless infrastructure supporting the 2.5 and 3G technologies, virtual private networks, content delivery services, carrier-grade web and application hosting, unified messaging services and call centers. Working closely with key telecommunication and computing companies, Intel is optimizing solutions and middleware for these platforms in the areas of converged services, operating system support, operations administration, and maintenance and network infrastructure. Intel Developer Forum is a worldwide program that gives developers technical information and vision to help them create innovative products for the Internet economy. The 2001 Spring IDF conferences, held earlier this year in San Jose, Tokyo, Taipei and Beijing and now Amsterdam, feature a full schedule of sessions and hands-on labs, along with numerous demonstrations of cutting-edge products and technologies. Industry participants include software and hardware developers of PC and handheld clients, servers and communications equipment. For more on semi-annual conferences held in the United States, Asia and Europe, visit developer.intel.com . For the latest information on technology developments throughout the year, visit Intel Developer Update at developer.intel.com . Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. Note to Editors: Third party marks and brands are property of their respective holders. -------------------------------------------------------------------------------- Contact: Intel Corporation Otto Pijpker, 503/712-1520 otto.pijpker@intel.com