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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: combjelly who wrote (48189)	7/18/2001 10:21:15 AM
From: heatsinker2	Read Replies (1) \| Respond to of 275872

Comb- Yeah, ORGANIC = PLASTIC. Well, actually the black plastic, known in the trade as molding compound, is a silica -filled epoxy. For thermally conductive packages, which I'm sure AMD would use, there is usually some sort of ceramic filler. Since they are saying organic, maybe the filler is some sort of graphite (carbon). This is a cheaper package. There is no advantage to the consumer, other than smaller size, because plastic package are less reliable than ceramic packages. But ceramic packages are expensive, so this is a big plus if AMD can make it work.

To: combjelly who wrote (48189)	7/18/2001 1:42:32 PM
From: Ali Chen	Read Replies (2) \| Respond to of 275872

"none of the chips in an organic package dissapate more than about 15-20 watts" You should know yourself that you are wrong on this. P-III happily dissipate up to 50-60W. The plastic carrier for flip-chip mounting technology is not supposed to dissipate anything. The main thermal path is still through the top of silicon into attached heat sink. The secondary thermal path through the carrier is probably 1/10 of that, so it's thermal condictivity should not matter much. - Ali