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To: Ali Chen who wrote (48235)	7/18/2001 1:48:14 PM
From: bacchus_ii	Respond to of 275872

RE:"The secondary thermal path through the carrier is probably 1/10 of that, so it's thermal condictivity should not matter much." And mostly through the pin.

To: Ali Chen who wrote (48235)	7/18/2001 2:08:01 PM
From: combjelly	Read Replies (1) \| Respond to of 275872

"You should know yourself that you are wrong on this. " Which is why I qualified the statement. While I knew that the Coppermines were originally in an organic package, I wasn't sure if that had changed with later, more power hungry parts. And yeah, I knew that the primary thermal path is through the back of the die, there will still be some radiated (if nothing else) through the front where it is facing part of the organic package. Thermal conductivity is not my concern as much as the softening point of the organic package. Heat that is conducted through the pins would have the same problem. I stand corrected on this.