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To: Jon Khymn who wrote (76433)	7/31/2001 5:36:43 PM
From: blake_paterson	Read Replies (2) \| Respond to of 93625

SI pulled his post the morning he was suspended (for 10 days, I think). BP

To: Jon Khymn who wrote (76433)	7/31/2001 6:46:30 PM
From: Bilow	Read Replies (1) \| Respond to of 93625

Hi Web Myst; Here's another interesting article about what the next big thing in electronics is going to be MCPs: Fujitsu offering 'triple-stacked' package for cellphones Semiconductor Business News, July 31, 2001 Fujitsu Ltd.'s European chip operation today claimed to be offering the industry's first triple-stacked multi-chip package (MCP) for cellular phones, combining three types of memories for digital handsets. The multi-chip package combines a 64-megabit NOR-type flash memory, a 16-Mbit mobile fast-cycle random access memory (FCRAM) with an asynchronous SRAM interface, and a 4-Mbit SRAM. Fujitsu said the triple-stacked MCP format addresses new demands in cell-phone handsets by packaging together flash for program and data storage, high data-capacity FCRAM as "working memory," and SRAM as cache memory for backup storage when downloading data or when systems are in standby mode. ... The multi-chip package reduces power used by combining memory chips and minimizing part counts as well as interconnect wiring. The 85-ball plastic ball grid array (PBGA) package measures 10.4-by-10.8-by-1.3mm. The height of the package is slightly slimmer than conventional MCPs, according to Fujitsu. By combining three chips into one package, the MCP uses 30% less board area than previous devices, said the company. ... The MB84VR5E3J1A is now available in sample quantities with volume production commencing in September. Pricing was not released. ebnonline.com What's going on here, is that the desire to make cell phones as small and light and energy efficient as possible is forcing the design of improvements in packaging technology. But the improvements actually are more general than just lower power and lighter weight, they also improve performance. We'd already be using MCMs to combine a processor with a few chips worth of extra DRAM type cache memory if the resulting performance improvements were large enough. While these are not cost effective for desktop PCs now, they will be as speeds scale up. Eventually desktop PCs will be built largely from single MCMs (or some similar technology) and there will be no big busses with high bandwidth signals passing through PCB. But before we get that far, we'll get to the point where desktop PCs have all their DRAM memory soldered into the motherboard. -- Carl

To: Jon Khymn who wrote (76433)	7/31/2001 8:14:13 PM
From: richard surckla	Read Replies (3) \| Respond to of 93625

Web Myst... You seem to be the new starry eyed kid on the block.There is an easier way of finding out Bilow's true colors. Just ask him if he ever admitted to lying on this board and if he ever said he was a paid basher. He can only answer these questions in the affirmative since he was ridiculed by posters here when he was caught. Also, Web Myst, I and many others believe he has a staff of writers and helpers helping to prepare his posts in a speedy and well thought manner. You're a bright person. Just ask yourself how can he do his postings so fast by himself... right... impossible. Of course Bilow will tell you he can do it because he is a fast typist.