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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: wanna_bmw who wrote (144862)	10/8/2001 12:55:36 AM
From: Elmer	Read Replies (1) \| Respond to of 186894

By removing the solder balls and placing the die directly into the packaging, Marcyk said it eliminates roughly three layers of the six or seven layers of metal that compose a processor such as the Pentium 4. I'm not so sure. Why would this eliminate metal layers? I can understand how it could facilitate power and ground routing but many of those interconnects are for routing logic signals from one node to another. How does it eliminate these? Assuming for a moment that I'm missing something here and this really does reduce the necessity of several metal layers, the significance goes beyond what you suggest. For starters the die could be denser because routing is a factor in growing die size. Second yields would improve because of the reduced defects that would result from reduced complexity. Smaller die and better base yields mean significantly reduced manufacturing costs and increased capacity. I'll believe it when I see it. EP