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To: AK2004 who wrote (146455)10/31/2001 2:50:09 PM
From: Tenchusatsu  Read Replies (2) | Respond to of 186894
 
Albert, <it does not bother you that Intel expected cost saving are only 25% from new process while most expected ~80%? >

Bull.

Tenchusatsu



To: AK2004 who wrote (146455)10/31/2001 2:57:34 PM
From: fingolfen  Read Replies (1) | Respond to of 186894
 
it does not bother you that Intel expected cost saving are only 25% from new process while most expected ~80%?

Who expected that Albert??? That's a brown elbow number if I've ever seen one. I've been following the 300mm news for quite some time and the highest number Intel has ever published is a 30% cost savings... I don't know who this mythical "most" is you allude to...



To: AK2004 who wrote (146455)10/31/2001 3:02:06 PM
From: wanna_bmw  Read Replies (1) | Respond to of 186894
 
albert
re: Intel expected cost saving are only 25% from new process while most expected ~80%

you're full of baloney. Intel's original expectation was 30%, not 80%.

intel.com

"The primary cost benefit is the ratio of die yeild per 300 mm wafer to die yield per 200 mm wafer. The yield improvement ranges from 2.25X for small die to 2.5X for larger die. The next cost benefit is quantity of output. The output of a 300 mm factory is 1.6-2.2X that of a 200 mm factory producing the same product. The output ratio also reduces the impact of the facility cost on product. A 300 mm factory will cost close to the same as a 200 mm factory but the product output is higher. The die and output scalars are the key drivers that provide an opportunity to achieve a 30% cost reduction for product made with 300 mm wafers."

Regards
-BMW