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To: Elmer who wrote (66603)12/29/2001 11:31:39 PM
From: Bill JacksonRead Replies (1) | Respond to of 275872
 
Elmer, I recall reading that traces of copper spreading from various parts of the process by whatever means can cause severe damage to wafers. I expect this is due to the nature of tiny amounts of copper ions 'doping' whatever they touch and diffusing here and there and in essence wrecking the parts.
This would mean all the inputs and outputs of whatever process chemicals, dopants, washes etc, would have to be issolated from each other.
Possibly in non copper processes there is a lack of this isolation. This means lots of changes to premit the copper process to operate.

Possibly someone who knows how and why copper is such a pestiferous material in terms of contamination could make a comment here?

Bill



To: Elmer who wrote (66603)12/30/2001 3:46:05 PM
From: fyodor_Respond to of 275872
 
Elmer: If R&D is limiting the output of F30 as some here suggest then AMD would be well served to do it's development elsewhere. People here claim F25 is underutilized so it only makes sense to free F30 to pump out AMD's moneymaker.

AMD doesn't have identical equipment across its fabs, as Intel does with its Copy Exactly! philosophy. This is clearly a disadvantage when it comes to process development and deployment across multiple fab sites.

There's also the issue of Cu contamination, which I recall 'Bees ranting about for months back before Fab30 came online.

-fyo