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To: Elmer who wrote (155851)1/16/2002 8:37:46 PM
From: milo_morai  Read Replies (2) | Respond to of 186894
 
Elmer I'd say your being a ARSE now. You fail to discuss 130nm runs and 130nm SOI. AMD already stated they expected to complete 130nm transition in Q4 2001.

Say HI to my ignore button as I don't care to see you as you're just a ROBOT.



To: Elmer who wrote (155851)1/16/2002 11:08:50 PM
From: Dan3  Read Replies (1) | Respond to of 186894
 
Re: see how many wafers AMD would have left over after only producing 4 million Athlons in Q4

Production sold in Q4 was FABed in Q3. Over 4 million Athlon XPs were sold, something like 1.5 Million Athlon4s, and a few hundred thousand Athlon MPs. The FAB is being used to develop both the .13 and SOI processes.

In Q3, the FAB was probably at 80% build out (say, 75% at the beginning of the quarter, and 85% at the end of the quarter). Take your 90% availability factor to account for maintenance and you have .8 * 5000 * .9 = 3600 possible wafer starts per week.

Of the 3600 say 10% of the equipment was being worked with to polish the .13 process, and 5% was being tied up with SOI runs. Now you have 3600 * .85 = 2880.

2880 * 13 weeks = 37440.

4+ million Athlon XPs + 1.5 million Athlon4s + 200K Athlon MPs = 5.7+ million chips. 5.7+ million chips from 37,440 wafers works out to more than 152 chips sold for each wafer start. Some wafers are lost to testing and QA processes, so the final number is even better.

With a die size of 128 or 129mm2 (I've seen both numbers) they're getting between 70% and 80% yields from the whole die. You're the one that told use that whole die near the edge of the wafer are often rejected for quality assurance reasons, so the real number is probably closer to that 80% figure - maybe higher.

Now, how'd you like to perform a similar exercise for Intel's 8 CPU FABs, several of which are twice the size of Dresden and cost twice as much to equip?