To: Petz who wrote (69463 ) 1/30/2002 4:35:04 AM From: bacchus_ii Read Replies (1) | Respond to of 275872 RE:"Question for the thread: Do either AMD or Intel make flash chips that include some RAM, so that a CPU doesn't have to wait for the long delays of writing to the flash memory for code that needs it? (e.g., the first 16K bytes are RAM and the next 48K are flash memory) (I assume having a separate RAM chip would increase costs)" Multi-Chip Package (MCP) Flash and SRAM Solutionsamd.com Overview AMD, the technology leader in Flash memory, announces worldwide availability of its industry-leading family of multi-chip package (MCP) Flash and SRAM memory solutions. Utilizing a single, convenient package including high-performance AMD Flash and the highest quality SRAM, MCP solutions offer customers the ability to design feature-rich applications while optimizing board space in today’s cutting-edge systems. Over ten million MCP devices have been flawlessly manufactured and shipped to date – the high-performance, ultra-low power consumption, and unmatched reliability of AMD’s proven MCP devices makes a perfect solution now offered to designers and manufacturers everywhere. Key features of currently available MCP solutions include the following: 16, 32, or 64 Mb 3.0 V Flash Memory packaged with a 2, 4, 8, or 16 Mb SRAM in a single, consistent Fine-pitch Ball Grid Array (FBGA) package Award-winning Simultaneous Read/Write (SRW) Flash capability between any two banks ZeroPower™ Flash when inactive; ultra-low power consumption during standby mode (0.2 uA) SecSi (Secured Silicon) Sector security Future MCP devices will feature alternative Flash devices, higher densities, additional packaging options, and new MCP combinations (e.g. Flash + ASIC, Flash + ASIC + SRAM, Flash + Flash, etc.) to meet any design specification. Small Footprint, Consistent Packaging Cellular handset designers and other leading manufacturers face the many challenges to eke out the latest features into smaller footprints. MCP devices meet these challenges by offering a single, space-saving package with the industry-leading performance and quality that customers have come to expect from AMD. Because AMD’s various MCP solutions are stacked in a consistent footprint and pinout, customers can easily design a single-board while differentiating their products. In addition, AMD’s advanced stacking technology can readily be applied to new Flash, SRAM, or other devices as they are introduced. Consequently, AMD will continue to offer customers the most value-added and cost-effective MCP solutions as innovations enter the marketplace. Streamline Your Supply-Chain, Focus On Your Designs AMD’s strong partnerships with leading manufacturers not only results in a reliable supply of SRAM for MCP devices, but also ensures that customers can benefit from any cost-reductions or advances in SRAM technology. Additionally, AMD manages the complex logistics, quality, and inventory management issues in procuring the best SRAM available, thereby enabling customers to streamline their supply-chain and focus on creating great products. Finally, AMD’s award-winning customer service and demonstrated commitment to customer success make MCP solutions an ideal choice for most portable applications. Applications AMD’s MCP solutions are ideal for a variety of applications requiring high-performance, low power-consumption, and a small footprint: Wireless Modems Cellular Handsets Two-way Pagers Personal Information Devices Handheld PCs GPS Receivers Wearable Computers Ordering Information