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Technology Stocks : Qualcomm Moderated Thread - please read rules before posting -- Ignore unavailable to you. Want to Upgrade?

To: cfoe who wrote (18637)	1/31/2002 12:42:41 PM
From: Neeka	Read Replies (1) \| Respond to of 197139

I was at the Bank of America Technology Conference Tuesday and saw the QCOM presentation by Don Schrock. Some good notes from the conference courtesy of Adam Oliensis. M Subject: conference notes Date: 1/29/02 2:32 PM Pacific Standard Time From: Oliensis Message-id: <20020129173242.28200.00000165@mb-ba.aol.com> Seoul to be covered by ev-do by end of April. All of Korea by end of CY '02. Largest fabless chip manufacturer in the world, surpassing XLNX this past year. on time w/ delivery of every single new product over the past 5 years. blue tooth, USB, java, brew already on chips. 802.11b either now or coming up on qcom chips. 10k units sold by foma 3g. 100k units w/ is95b in japan...w/ same functionality. japan has rolled out qcom gps nationwide. pcs, leap, vz all have gps phones available. in '02. msm6000 family. supports 1x/gsm, wcdma/gsm, on a single chip uses wireless internet launchpad across all platforms. based on brand new radio architecture caled RF1. leads to 50% reduction in components. it's hte only way to do duel mode chipset. otherwise you're glueing IF and RF components together. no good. msm6000--entry level 6050 has pos. location, multimedia 6100, new dsp arch., new gps architecture, graphics hardware acceleration and camera interface. q3 2 duel mode chips (2). can use in every country int he world. all protocols. can do video conferencing then high speed chip. chip will function as chip that can be video camera. then 12" wafers (first wireless chips to use this). made by TSM. ALL ON ONE CHIP. GSM, WCDMA, bluetooth, position location, arm m/processor and dsp all on one chip. That's how you get 50% reduction in external components. Oliensis