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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Windsock who wrote (159169)	2/18/2002 4:31:23 PM
From: Elmer	Read Replies (1) \| Respond to of 186894

A system level test socket for testing semiconductor packages having non-pin grid array footprints. The test socket having solder pads positioned on the test socket to form electrical connections with corresponding leads on the bottom of the semiconductor package. The test socket has internal connections connecting each solder pad with a corresponding connection on the bottom of the test socket. The test socket is mounted on a burn-in board, thus allowing a semiconductor package having a non-pin grid array footprint to be tested without requiring an interposer for converting the non-pin grid array footprint of the semiconductor package. In addition, the test socket includes guide posts which align with guide slots on a hydraulic cylinder. The hydraulic cylinder compresses the semiconductor package to the test socket thereby ensuring solid connections between the semiconductor package and test socket. This would be laughed out of any court in the land. There is absolutely nothing new or unique in any of these patents. EP

To: Windsock who wrote (159169)	2/18/2002 5:29:48 PM
From: Bill Jackson	Read Replies (1) \| Respond to of 186894

Windsock, Why, One fine day AMD might have Intel over a barrel with those patents, senseless as they seem to you, someone felt they were worth filing, at least for defensive purposes, just in case someone else filed them and sent AMD a lawyers letter. Xero, and many other people publish books in which they place details of some processes clearly into the public domain, for just that reason. Bill