To: Jerome who wrote (717 ) 2/21/2002 1:24:09 PM From: Proud_Infidel Respond to of 25522 Philips, STMicro and TSMC reportedly plan 300-mm venture Semiconductor Business News (02/21/02 11:07 a.m. EST) AMSTERDAM -- Royal Philips Electronics N.V. and STMicroelectronics are planning to announce a 300-mm wafer fab joint venture with silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd., according to an unidentified industry source quoted today by the Reuters news agency here. The news service said an announcement is expected in March, but Philips in the Netherlands refused to comment on the report, said Reuters. STMicroelectronics, the Franco-Italian chip maker based in the Geneva area, and TSMC in Taiwan were not immediately available for comment. TSMC and Philips Semiconductors have formed a $1.2 billion 200-mm foundry venture in Singapore, called Systems on Silicon Manufacturing Co. (see Sept. 29 story). The SSMC venture opened its 200-mm (8-inch) wafer fab last spring with tool sets and technologies for production of system-on-chip products initially based on 0.25- and 0.18-micron processes (see May 23 story). The SSMC facility is scheduled to move to 0.15-micron and below processes this year. Meanwhile, STMicroelectronics also has a high-volume wafer fab in Singapore, and it has been cooperating with Philips in 300-mm development and pilot production at the company's plant site in Crolles, France (see April 13, 2000, story). Reports of a possible 300-mm (12-inch) fab venture between Philips, ST, and TSMC come several weeks after Advanced Micro Devices Inc. (AMD) announced plans to join silicon foundry supplier United Microelectronics Corp. (UMC) in a 300-mm production company, to be called AU Pte Ltd., in Singapore. The AMD-UMC venture will be located at a complex that currently houses another 300-mm company, called UMCi Pte Ltd., which was formed by UMC and Infineon Technologies AG of Germany (see Dec. 14, 2000, story).