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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: StanX Long who wrote (61382)	3/4/2002 10:51:54 PM
From: StanX Long	Read Replies (1) \| Respond to of 70976

IBM to fab Xilinx ICs, moves copper 0.13-/0.10-micron processes to foundry services Semiconductor Business News (03/04/02 08:35 a.m. EST) siliconstrategies.com EAST FISHKILL, N.Y. -- IBM Corp. today announced it will make available its most advanced copper-based chip processing technologies to Xilinx Inc. as part of a multi-million dollar, two-year foundry agreement to produce field-programmable gate arrays for the San Jose-based FPGA supplier. IBM said the new manufacturing pact marks the first time it has agreed to make available 0.13- and 0.10-micron copper-based processes to a foundry customer. Until now, IBM has only used these technologies for its own microprocessors, custom ICs and memory products, according to the company's Microelectronics Division in East Fishkill. Xilinx's new Virtex-II FPGAs will be fabricated at IBM facilities in Burlington, Vt., and East Fishkill under the new foundry agreement, which officials said culminated a two-year collaboration in technology development between the two companies. In the summer of 2000, Xilinx and IBM announced they would develop a "hybrid approach" to making custom chips with FPGA and PowerPC processor cores. That deal also included a foundry agreement (see July 25, 2000, story).