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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: semiconeng who wrote (73482)	3/5/2002 5:15:49 PM
From: Elmer	Read Replies (1) \| Respond to of 275872

My WAG would be somewhere in the neighborhood of an additional 15-20 operations per layer, or approx 45-60 additional process steps for the 3 additional Metal Layers. Each additional step has the potential for additional defect introduction. No big deal. AMD's yields are world class so there's nothing to worry about. You have noticed the high volumes of .13u products flooding the market haven't you? Haven't you? EP

To: semiconeng who wrote (73482)	3/5/2002 5:19:02 PM
From: TGPTNDR	Read Replies (1) \| Respond to of 275872

Semiconeng, Re: <each additional layer would most likely require (NOT Necessarily in this specific order), the addition of an Insulating Dielectric, an Litho Pattern application for the Trench, an Etch step to cut the Trench, a Litho Pattern application for the Interconect Via's, an Etch step to cut the Vias in the dielectric, the insertion of the Via Plugs, the introduction of the copper metal, and a planerization. This does not include the additional Defect Metrology, and Critical Dimension Analytical steps. My WAG would be somewhere in the neighborhood of an additional 15-20 operations per layer, or approx 45-60 additional process steps for the 3 additional Metal Layers. Each additional step has the potential for additional defect introduction.> Interesting. How many weeks would you expect these * EXTRA * steps to take? tgptndr