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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Paul Engel who wrote (162404)	3/17/2002 9:42:20 PM
From: wanna_bmw	Read Replies (3) \| Respond to of 186894

Paul, Re: "This extra copper layer will allow additional routing resources for the designers - and hopefully permit better compaction than with just 6 copper layers." I'm sure one of the resident experts can answer this better than I can, but I've been under the impression that extra metal layers are a liability, rather than an asset. AMD's .13u process has 9 copper layers. While you are correct that this will make routing easier and more compact, it will also mean more steps in manufacturing, which mean longer turn-around times, and more $$$. I just don't know whether the pros outweigh the cons. wbmw