To: StanX Long who wrote (62413 ) 3/28/2002 12:37:26 AM From: StanX Long Read Replies (1) | Respond to of 70976 Applied Intros Defect Detection System for 100nm Copper Chips Online staff -- Electronic News, 3/27/2002e-insite.net Applied Materials Inc. today launched an inspection system with new applications for detecting defects on 100nm-and-below generation copper-based semiconductor chips. The CompassPro system is based on Applied’s existing Compass product, but adds multi-perspective grain suppression, all-optical dynamic range and AccuScan technologies. These are used to not just identify, but also act on defect information, the company said. Applied described its new system as accelerating the ramping of copper-based chip production, increasing the speed and sensitivity needed to identify yield limiting defects faster and more accurately, all at a significantly lower cost. The Santa Clara, Calif.-based chip equipment company said its multi-perspective grain suppression technology uses the composite imaging from multiple perspectives to enhance defect detection on a range of grainy films, including those found on copper interconnect layers. The CompassPro system’s AccuScan technology provides die-to-die comparison accuracy, leading to superior defect capture rates, Applied said. The company claims it has up to double the sensitivity of other inspection technologies. The all optical dynamic range technology is designed for devices with widely varying optical properties. It provides variable sensitivity for single-pass full die inspection. "The CompassPro system has substantially accelerated yield learning during development of our copper dual damascene products, including our multi-system process modules," said Michael Armacost, general manager of Applied Materials’ dual damascene module group, in a statement. "The system’s capability to find small, critical defects in high aspect ratio trench and via structures, together with Applied Materials’ extensive Defect Knowledge Library software, enabled us to quickly find killer defects and eliminate their root causes."