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To: Mani1 who wrote (77907)	4/22/2002 2:09:23 AM
From: tcmay	Read Replies (3) \| Respond to of 275872

In all of the configurations I see listed in the usual places, the area of the IHS or slug or both is NOT an issue in terms of increasing the thermal resistance. Making the IHS or slug smaller in area would NOT mean the die is in better thermal contact with the rest of the package AS THE IHS/SLUG IS THE ONLY PATH (aside from air gaps or vacuum gaps or resin, all of which would be higher in thermal resistance, obviously). So, your point about how increasing the heat spreader or slug area will increase thermal resistance makes no sense. --Tim May