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To: pgerassi who wrote (78002)	4/23/2002 7:21:14 AM
From: Bill Jackson	Read Replies (1) \| Respond to of 275872

Pete, I do not quite agree with all your points. the die to spreader thermal resistance will be a lot lower than the old die to heat sink method. Why? because it will be factory done and designed to be that way. The spreader to heat sink resistance will also be lower and in addition will be a larger area. lateral heat flow in the spreader will be a lot more rapid than through Si. Why? very flat surfaces and the ability to apply greater pressure to make the mating flats very close, = less thermal paste in the gap = lower thermal R. In addition it will indeed be more ham hand prrof. Bill