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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Bill Jackson who wrote (78178)	4/24/2002 8:15:17 PM
From: pgerassi	Read Replies (1) \| Respond to of 275872

Dear Bill: Have you not listened at all? Are you deaf? The reason that the bumps are on the die is simple, they can put them there or on the substrate, but they cannot put the pads on the die since they need to be so thick. That means that processing time and cost goes up. And both Intel and AMD are trying to cut costs, not increase them and increase production rates, not cut them to a fraction of where they are. Packages are cheap, dies aren't, at least in this area, desktop and above CPUs. The HIS to CPU is one bond, but the die to substrate is hundreds and in the case of Sledgehammer, nearly a thousand all on a die of 100mm2. That's a density of ten bonds per mm2. Now you should appreciate the difference. They can not screw up the die to substrate bonds. They are far more critical than any HIS bond. Besides manhandling a die is much easier than a die plus a HIS. Surely you see that. Pete