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To: Tony Viola who wrote (164686)4/29/2002 12:15:29 PM
From: fingolfen  Read Replies (1) | Respond to of 186894
 
OK, I'll play dumb (not hard). Why's that (...major coup on 300mm!)?

Lots of reasons, and all of this is predicated on an "if"...

If defect density is matched between 200mm and 300mm this means that Intel has solved numerous potential process issues related to a wafer size conversion.

One of the biggest issues facing the semiconductor industry as a whole is cross wafer uniformity. This is especially true in etch, deposition, and polish modules. One would at least hypothetically expect a 300mm wafer to start with a good 200mm process (the center of the wafer is okay, but the edges aren't). In order to gain the benefits of the larger wafer size, those problems must be overcome.

Again, this is an "if" presuming matched or near matched defect density.