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To: ptanner who wrote (79178)	5/3/2002 1:54:23 AM
From: wanna_bmw	Read Replies (1) \| Respond to of 275872

PT, Re: "I got my dimensions from p. 12 for the southbridge (about 20x20) and p. 23 for the northbridge. The latter was a reference to a 12x12 TIM which I assumed was the right size for the northbridge." Careful not to confuse the die size with the size of the package. The enclosure around the silicon may be much bigger than the actual silicon itself. 80-90mm^2 sounds about right to me for a northbridge, and southbridges are about 50-60mm^2. Both obviously depend on the manufacturing process, and the number of features you want to implement on to the die. I've also heard that some chipset designers will make the die size intentionally larger in order to decrease the thermal density of the chip, and allow for easier cooling (remember that chipsets don't get the luxury of ultra-big heatsinks like the CPUs get). wbmw