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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?


To: Joe NYC who wrote (87434)8/22/2002 4:16:16 AM
From: Gopher BrokeRead Replies (3) | Respond to of 275872
 
A couple of interesting extracts.

In a conference call with the company yesterday, we were informed that the initial Thoroughbred were gated by routing congestion which imposed speed paths. To overcome this problem, AMD added an additional metal layer.

The additional metal layer will make the new Thoroughbred slightly more expensive to produce. AMD representative characterized this additional cost as “noise.” Although we agree that the move to nine-layers will not cost AMD much on a per-die basis, it could add a day to the production pipeline.

The new Thoroughbred die is also slightly larger at 84 mm^2 because of the addition of on-die decoupling capacitors. The addition of these capacitors could potentially help the Athlon XP reach higher Front-Side Bus (FSB) speeds. The increased die-size will correspondingly reduce the number of die / wafer by roughly 5%.

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Hoping to influence the organization for the better, AMD has told us that it has joined BAPCo as a full member. The chipmaker also has produced convincing evidence to substantiate that SysMark 2002 is broken. In fact, the data suggests a profoundly skewed workload which supports our longstanding contention that BAPCo has been essentially producing Intel marketing tools. We will cover these issues in more detail in an upcoming article.


vanshardware.com