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To: robert b furman who wrote (1054)10/18/2002 1:09:10 PM
From: j t jackson  Read Replies (1) | Respond to of 1227
 
Bob...indivusal wafer process steps under vacuum take from a few seconds to a few minutes. Most wafer fab lines start 25,000, 200mm diameter silicon wafers per month. Since there are many chips per wafer, the number of chips per month is quite large. A single wafer may go into and out of a vacuum chamber 20 to 40 times from start to finish during the processing of a silicon wafer into a finished semiconductor wafer.
Depending on the mass flow of gas into the cryopump they are capable of running from hundreds to thousands of hours between regeneration steps.
Regards...jtj