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Technology Stocks : Semi Equipment Analysis -- Ignore unavailable to you. Want to Upgrade?

To: Cary Salsberg who wrote (8170)1/23/2003 1:07:30 PM
From: Kirk ©  Read Replies (3) | Respond to of 95738
 
I believe this is a technology issue, not a capacity issue. I think I remember reading that the new Maxxam bonder is needed for more advanced chips.

That would make sense. For a wirebonder, I think the only technology upgrades besides productivity would be finer pitch, higher quality, bigger chips or different metals. Have I missed some?

This page kns.com
seems to indicate that the old bonder would do 45um bonds but users get higher productivity with the "Maxum IC Ball Bonder".

So, that says to me that buyers are adding capacity unless all of a sudden some major users are going to larger chips.



To: Cary Salsberg who wrote (8170)1/23/2003 2:05:20 PM
From: Ian@SI  Respond to of 95738
 
If you listen to the KLIC conference call Scott K. goes into this at length. .13µ yields have improved substantially. More wafers are being processed at that feature size. The resulting chips need the capabilities of the Maxxµm. I didn't hear Scott say anything about more chips in total, just more chips at .13µ as the driver.

Thus the current bonder boom is technology driven not capacity driven. For KLIC, there's not much difference between the 2.


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