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Technology Stocks : Semi Equipment Analysis -- Ignore unavailable to you. Want to Upgrade?

To: Cary Salsberg who wrote (8174)	1/23/2003 3:06:01 PM
From: Kirk ©	Read Replies (1) \| Respond to of 95738

I think this is worth understanding. So far I have not seen anyone list a technology that the older bonder didn't do, just at a much slower pace. Higher yields mean fewer wafer starts, not more wirebonds. That "reason" from CSFB gave me a good chuckle. "We are pleased with the performance of the Maxum ball bonders for ultra-fine-pitch, high-lead-count semiconductor packages. These bonders will supplement those already in operation and will be used for ball grid array (BGA) packages and other devices requiring leading edge capabilities." Again, tell me what the Maxum does that the older one doesn't besides work faster (more capacity). IF I were running a fab, there is no way I'd be adding expensive bonders that would just sit idle for longer periods than my current bonders. IF I were running a semicompany, I'd sure not want to tip my competitors that I was adding capacity to meet demand... as I'd want to sell all that capacity at the highest price possible before my competitors increased their capacity. Remember, there is a reason we wanted to watch KLIC. All I want to see here is what does this Maxum do that present tools don't. THEN I will agree it is a technology upgrade. MAYBE the customer didn't have 45um pitch capability before? Kirk