To: Proud_Infidel who wrote (8911 ) 2/17/2004 9:27:02 AM From: Proud_Infidel Respond to of 25522 Semitool Licenses Seed Layer Enhancement IP To Applied Materials Tuesday February 17, 7:23 am ET KALISPELL, Mt.--(BUSINESS WIRE)--Feb. 17, 2004--Semitool, Inc. (Nasdaq: SMTL - News), announced today that it has licensed the company's patented seed layer enhancement intellectual property (IP) to Applied Materials, Inc. (Nasdaq: AMAT - News). Semitool's seed layer enhancement process, which is used in fabricating copper interconnects, optimizes the initial seed layer for the subsequent bulk deposition of copper in the manufacture of integrated circuits. As part of the license agreement, Semitool received an initial license fee from Applied Materials and is entitled to receive an additional fee upon commercialization, as well as future royalties. The license agreement does not include any rights to Semitool's bulk-fill electroplating intellectual property. Semitool and Applied Materials also agreed to dismiss the patent infringement litigation brought by Semitool in the United States District Court for the District of Oregon. Ray Thompson, Semitool's president and chief executive officer, said, "We are pleased with Applied Materials' decision to license our seed layer enhancement IP for use in their electroplating system. I believe this joint agreement is an excellent opportunity for Semitool to expand the influence of our electrochemical deposition technology in the semiconductor industry." About Semitool, Inc. Semitool designs, manufactures and supports highly engineered, single-wafer and multi-wafer wet chemical processing equipment used in the fabrication of semiconductor devices. The company's primary suites of equipment include electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems. The company's equipment is used in semiconductor fabrication front-end and back-end processes, including wafer level packaging. Headquartered in Kalispell, Montana, Semitool maintains sales and support centers in the United States, Europe and Asia. The company's stock trades on the Nasdaq National Market under the symbol SMTL. For more information, please visit the company's website at www.semitool.com. Semitool is a registered trademark of Semitool, Inc.