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To: Petz who wrote (148884)1/24/2005 2:05:14 PM
From: etchmeisterRead Replies (2) | Respond to of 275872
 
Or to put it another way, yes, there are exactly as many defects on a 300mm wafer regardless whether it's the Smithfield die or the Prescott die. The first order assumption is that each defect kills 1 CPU. But the Smithfield die has <50% as many CPUs on it to begin with, so a greater percentage of CPUs are killed.

Petz

yes but overall DD should be pretty low;
isn't that one of the reasons to run SRAM -
On relative base more (DC)dies are getting killed but how many Prescotts are getting killed today?