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To: pgerassi who wrote (228608)	3/20/2007 9:53:38 PM
From: Saturn V	Read Replies (1) \| Respond to of 275872

Pete, Silicon wafers when they are being processed have to be thick to allow mechanical handling during wafer processing. The standard thickness of finished wafers used to be 500um, but most users have migrated to half thickness wafers of 250um. Half thickness wafers can be handled at Wafer Sort etc. I have measured thickness of Silicon on Intel and AMD packaged devices for several years and they are nowhere near 1mm thick. What I am talking about is wafer/die thinning as a part of final packaging/assembly. Two years ago I personally saw a demo for DISCO wafer thinning/packaging process which took the final die thickness to below 100um. DISCO claimed that this process is used for high power devices by unnamed users. Anyhow Pete I find your back of the envelope models highly simplistic and questionable. In practice things are much more complicated. You have already made several errors on a first order model. I will not respond any further on this issue.