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To: Elmer Phud who wrote (248656)3/12/2008 1:47:52 PM
From: pgerassiRead Replies (2) | Respond to of 275872
 
Ephud:

Are you really this dense? The fuses are on the die. Its even on Nehalem. Although there are redundant rows in caches, redundancy is very rare on array columns. You might fix a bad row, but columns usually require loss of the array. It is easier to simply fuse off sections which are designed for the start to allow. Halves and quarters are normal for most die designs. Look at Phenom, it only needs one HT link to be a perfect CPU. It has four to try. Even if its in the NB portion of that link that is defective, three others could be just fine.

My brother builds test equipment. In milliseconds, they can determine what sections are active and likely good. And this is normally done before the wafer is diced. Low enough error rates to make the packaging and fusing decision for a die and even a good guess as to likely final bin. Of course, the final diced, packaged and fused dies are tested more rigorously. And QA does take random samples through far more elaborate tests.

There is no complications to the flow, just the same test equipment, test vectors and decision tree from the results. Good test vectors and decision tree programming are required usually done by engineers specializing in test with input from both design and manufacturing.

But if you are really in that end of the business, you should have known all that. Its curious that you didn't.

Pete