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To: Elmer Phud who wrote (248707)3/14/2008 6:26:51 PM
From: THE WATSONYOUTHRead Replies (2) | Respond to of 275872
 
Mechanical specifications are not imorphic by nature. If they were they wouldn't be mechanical specifications. This is not a difficult concept to grasp. A little effort on your part would go a long way.

Oh really. Explain to everyone how in the Celeron 500 series document, the chip dimensions in the package do not include the passivation layer but in the Celeron 200 series the great wbmw divines that in that case the die dimensions in the same package do contain the passivation layer. Further more.....in the CMOS 400 series, there is NO die dimension specified at all in the package. Tell us all what concept we should grasp here.

THE WATSONYOUTH