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To: THE WATSONYOUTH who wrote (248763)	3/14/2008 8:14:01 PM
From: Elmer Phud	Respond to of 275872

Explain to everyone how in the Celeron 500 series document, the chip dimensions in the package do not include the passivation layer but in the Celeron 200 series the great wbmw divines that in that case the die dimensions in the same package do contain the passivation layer. Perhaps one is a controlled step and the other isn't? Just a guess. I think you are straying a little from the point. We're not talking fractions of a mm here. Another poster claimed the dimensions published as die size were a blended average of 2 entirely different die sizes. That is not likely to be the case for a mechanical specification. You should know that. Further more.....in the CMOS 400 series, there is NO die dimension specified at all in the package. Tell us all what concept we should grasp here. Perhaps the die size has no bearing on the application? Again, just guessing. What's your point? Are you trying to tie this back into your wild guesses on Intel's yields? Don't waste any more of my time on a subject you know nothing about. Just admit it, you think Intel is lying about their yields. I on the other hand think you don't know much about this subject, that or you spent too much time around a company with bad yields. edn.com eetimes.com I have lots more if you're interested.

To: THE WATSONYOUTH who wrote (248763)	3/14/2008 8:15:45 PM
From: wbmw	Read Replies (1) \| Respond to of 275872

Re: Further more.....in the CMOS 400 series, there is NO die dimension specified at all in the package. The specs aren't for YOU to infer the die size. They are for systems designers to build adequate cooling solutions. In the case of the Celeron 400 series, there is an integrated heat spreader over the die, so - appropriately - you get the mechanical specs for an integrated heat spreader in place of the die length and width. There are also packaging differences between the Celeron 200 series and Celeron 500 series, the latter of which is a mobile part. I address this one in the last message I posted. These aren't tough concepts to grasp, Watson. All the things you are so rudely demanding can be found in the specs.