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To: Paul Engel who wrote (37189)10/21/1997 10:31:00 PM
From: Elmer  Read Replies (1) | Respond to of 186894
 
<arry - Re: " While AMD's variable cost per die (as opposed to cost per good die) is lower than Intel's (because their die are smaller due to the 5 metal layer process).."

Unfortunately for AMD, this isn't quite so.>

Paul, could you comment on TPT (throughtput time for those who don't
know). It seems that too many people assume that a smaller die is
always a cheaper die. I don't believe we can make this assumption.
Does AMD's 5 metal layers plus local interconnects/buried contacts
result in longer processing times compared to Intels .35u 4 metal
layer process. Doesn't this need to be factored in when computing die
costs? Isn't the real measure of die cost total good die per unit of
time?

EP



To: Paul Engel who wrote (37189)10/22/1997 9:44:00 AM
From: Larry Loeb  Respond to of 186894
 
Thanks for your correction.

Larry