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Technology Stocks : Semi-Equips - Buy when BLOOD is running in the streets! -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (3083)	10/26/1997 6:49:00 PM
From: Sam Citron	Read Replies (1) \| Respond to of 10921

Brian, Tessera is in microball-grid-array packaging technology (micro-BGA). It is 80% smaller and 17% thinner than traditional thin, small-outline packages for Si chips. What is unique about Tessera is that Tessera's package is CTE (coefficient of thermal expansion) compliant: capable of absorbing stress created by thermal expansion w/o sacrificing IC performance. Tessera's licencees include Intel, Hitachi, Read-Rite, Texas Instruments, 3M, Samsung. This chip-scale packaging approach is more robust and testable than flip chips, according to what I have heard. It should make wire bonders a thing of the past for devices requiring many contacts. Check out their website at www.tessera.com. Tel: 408-894-0700 Let me know what you think. I don't know IPO date. Caveat: I am not in the industry. My info is from sources considered reliable, including Red Herring and Gilder Tech Report. Like any hot IPO, it will be begin trading at obscene prices. It will then probably get more obscene. Look for it to behave like Rambus. SC