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To: semi engineer who wrote (1988)	11/4/1997 7:30:00 AM
From: Alan Siegal	Read Replies (2) \| Respond to of 5482

Fellas, re: << He has also confirmed that KLIC has a flip chip machine that could be several hundred Mil business in three to five years >> Was it on this thread that I read that KLIC/Delco will not be making machines, but will be bumping other people's chips? (Sounds unlikely) Is the machine referred to above to be made by the JV or KLIC alone? I thought I knew what's going on but I'm getting sort of cloudy now.

To: semi engineer who wrote (1988)	11/4/1997 7:32:00 AM
From: GarryP	Read Replies (1) \| Respond to of 5482

Semi , Going back to the uBGA - yes the systems can be modified from conventional wire bonders to produce this package but the optimum solution will be a system dedicated for this - reel to reel handling / TAB etc. - with so many companies (Sony being the latest) going to uBGA have you heard if KLIC is introducing a dedicated system for this ? I see more opportunities short term in uBGA than flip chip. Regards , GaryP

To: semi engineer who wrote (1988)	11/4/1997 11:08:00 PM
From: Sam Citron	Read Replies (3) \| Respond to of 5482

Semi engineer, KLIC gave up trying to produce a competitive flip chip machine. They aborted the project and say that they don't even think such equipment will be that lucrative a market. ETEC will lead in this equipment on business from INTC. KLIC will bump chips for others (Flip Chip Tech jv w/ Delco) but will not be making bumping equipment. KLIC will attempt to move more toward sales of consumables as wire bonders mature and start to become extinct (1999-2002 timeframe). KLIC is a short term cycle play and is coming back because it was oversold. SC