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To: Zeev Hed who wrote (9814)	11/15/1997 7:49:00 PM
From: BillyG	Respond to of 25960

Zeev, good point on the copper process. Electroplating is a lot different from deposition or sputtering. Perhaps the plating does not create a copper layer that is both level with the top of the trench and without a gap between the copper and trench sidewalls. In that case, you may want to CMP to get a planar surface for the next layers.

To: Zeev Hed who wrote (9814)	11/16/1997 12:52:00 AM
From: Maxwell	Read Replies (1) \| Respond to of 25960

Zeev: I don't think you really understand what I was talking about. For you to electroplate Copper you need a "seed layer" which is also copper about 500 angstrom in thickness. The way you deposit seed layer is through CVD method. Deposition using CVD means you deposit copper everywhere, inside the trenches as well as on top of the oxide. Electroplating is then done (also an electrodeless method) on top of the seed layer in a sink. You then need to polish off the copper off. The copper on top of the oxide gets polish away. The copper in the trenches remain and form metal lines for interconnect. Your method also works but it takes more steps than the one I described above. Maxwell