SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Cymer (CYMI) NEWS ONLY! -- Ignore unavailable to you. Want to Upgrade?


To: Paul Dieterich who wrote (238)12/3/1997 11:26:00 AM
From: Paul Dieterich  Read Replies (1) | Respond to of 582
 
Cap Equip Spending: Up 11.6% in '98, 17.5% in '99, 22% in '00:

North American IC capital spending surges while Asia cools off, says survey

A service of Semiconductor Business News, CMP Media Inc.
Story posted at 8:30 a.m. EST/5:30 a.m. PST, 12/3/97

By Jack Robertson

CHIBA, Japan --The global chip-production equipment market should grow 7.7% to $28.3 billion in 1997, according to the latest industry consensus survey conducted by Semiconductor Equipment and Material International (SEMI). The trade group here today presented its new equipment procurement outlook during SEMI's Semicon Japan conference.

The current outlook for growth is in contrast with SEMI's earlier forecast, which showed a slight decline this year, said Stanley Myers, president of the trade group.

Myers said the 1998 outlook now shows an 11.6% increase in capital equipment spending by chip makers, pushing the market to $31.6 billion. SEMI's industry consensus survey shows the equipment market will increase by 17.5% in 1999 to $37.1 billion.

By the year 2000, semiconductor capital equipment markets will hit $45.5 billion, with a 22% increase in spending that year, according to the latest survey by SEMI.

The survey, however, showed that Japanese equipment shipments would actually decline 16% in 1997 to $6.6 billion due to the slowdown in capital spending. Japan, however, is expected to rebound next year for a 10% gain to $7.3 billion, and increase 14.9% in 1999 to $8.4 billion.

The revised SEMI forecast hiked the estimate for North American shipments beyond earlier projections due to booming sales that will reach a total $9.3 billion this year--a hefty 24% jump over 1996 revenues totals. Capital equipment shipments in North America are expected to rise 15.9% to $10.7 billion in 1998, followed by a 17.5% increase to $12.6 billion in 1999, and another 22.3% rise to $15.4 billion in 2000.

Myers said the outlook for capital spending in Asian--outside Japan--shows a 21% increase to $9.2 billion in 1997, followed by 9% growth to $10 billion in 1998. He said he believed the region would not be impacted greatly by the current economic crisis hitting some Asian countries.

"Much of the semiconductor equipment being installed in the Asian fabs is for technology upgrades, which will go forward in any event," he said.

Wafer processing equipment revenues are expected to grow 5% this year to $19.5 billion. In 1998, chip makers are expected to buy $21.7 billion worth of fab gear, a 9% increase over 1997 levels, according to the SEMI survey. In 1999, fab equipment shipments will grow 20.3% to $25.7 billion.

In the test equipment segment, revenues are expected to grow 8.5% in 1997 to $5.2 billion, followed by a 10.2% increase to $5.7 billion and a 15.3% rise to $6.6 billion in 1999, according to the new SEMI industry consensus.



To: Paul Dieterich who wrote (238)12/3/1997 11:58:00 AM
From: Paul Dieterich  Read Replies (1) | Respond to of 582
 
LG Semicon: .25 key to production yields, speed in SDRAM:

From the December 1, 1997 Issue of Electronic News

LG Semicon has claimed title to the world's fastest 16-megabit synchronous DRAM (SDRAM) by reducing column address access time to less than 16 nanoseconds. This is nearly 30 percent faster than current SDRAM chips. The chip is also clocked at 133MHz, double the 66MHz speed seen in most current SDRAMs. "LGS' technological advantages in SDRAM development will deliver increased operating efficiency and performance to customers at the same price as conventional DRAM with the same density," said Duke Koo, LG Semicon senior managing director of international sales and trade affairs. "Our engineers utilized both the 0.25-micron design rule and thin film processing technology to develop this superior product. We achieved a 21 percent reduction in operating power consumption and 37 percent shrinkage in chip size, meaning we'll fit 60 percent more chips on each wafer."