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To: Petz who wrote (2823)	12/10/1997 1:27:00 AM
From: Brian Hutcheson	Read Replies (1) \| Respond to of 6843

Petz , re. Paul's claim that C4 is done by IBM I seriously doubt that since in the AMD quarterly magazine they state that the C4 is licensed from IBM . I will be able to tell you more after I contact AMD , regards , Brian

To: Petz who wrote (2823)	12/10/1997 2:32:00 AM
From: Paul Engel	Read Replies (2) \| Respond to of 6843

Petz - Re: "AMD & C4 Bump Processing" AMD released a 10Q on Edgar about 5 months ago describing the C4 relationship with IBM. However, certain sections were intentionally deleted - which IBM did not want revealed. Nevertheless, during the Q3 conference call, Sanders discussed the fact that AMD had to ship wafers to IBM for the completion of the C4 bump processing - this adds the controlled collapse solder bumps to the the device, each of which connects the outside world (a package connection) to an internal node (I/O, Vcc, etc.) inside the chip. Sanders indicated that AMD was working on the C4 process but was not capable of doing it at the time (October 7 ?). Where IBM does this C4 is not clear to me. Most of their production facilities are in Burlington, Vt. so I would assume that is where the C4 processing is performed. The packaging requires flip-chip bonding and again, I think IBM is heavily involved in this operation as well. AMD has major assembly plants in Penang (Malaysia) and Bangkok (Thailand). Are the marks you saw from either of these two countries? Paul